The iND87200 SoC from indie Semiconductor allows in-cabin gadget charging compliant with the Wi-fi Energy Consortium (WPC) Qi 1.3 customary. It additionally helps the rising Qi2 customary for improved on-the-move charging reliability.
The chip integrates a lift converter that delivers as much as 15 W of energy throughout the complete battery voltage working vary, whereas energy sensing circuitry screens system impedance and part in actual time. A dual-core design employs an Arm Cortex-M4F processor with 2 MB of embedded Flash and 256 kB of SRAM and a devoted Arm Cortex-M0 processor for the Qi stack. This strategy frees SoC compute sources to execute user-specific software program with out timing and interrupt constraints associated to the Qi stack.
Built-in energy administration capabilities allow the iND87200 to attach on to an automotive energy bus. On-chip serial interfaces, resembling CAN 2.0B, LIN, I2C, and UARTs, help a number of connectivity choices to the car and different peripherals.
The iND87200’s compatibility with the brand new Qi2 customary that includes the Magnetic Energy Profile (MPP) is especially related to automotive designs. It affords sooner, extra dependable charging by robotically aligning smartphones with an inductive charging coil, sustaining the gadget in place irrespective of car movement.
Absolutely certified to AEC-Q100 Grade 2, the iND87200 operates over a temperature vary of -40°C to +105°C and is available in a 12×12-mm, 102-pin QFP. The half is manufacturing launched and at the moment sampling to prospects.
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