Sawnics introduced a course of design equipment (PDK) based mostly on Soitec’s Join piezo-on-insulator (POI) substrates to speed up RF filter design for 5G smartphones. The South Korean foundry, with experience in floor acoustic wave (SAW) filters, expects the Join POI PDK will create new alternatives for the event and manufacturing of state-of-the-art 5G smartphone filters.
The PDK simplifies the event and manufacturing of filters constructed on Join POI engineered substrates by decreasing the variety of design iterations, whereas assembly more and more stringent 5G necessities. It additionally permits fabless corporations to achieve simpler entry to this RF filter expertise.
Produced with Soitec’s Sensible Lower layer switch expertise, Join POI substrates are well-suited for the manufacture of new-generation SAW filters. In contrast with applied sciences based mostly on standard supplies, Join POI merchandise present built-in temperature compensation, facilitate the mixing of a number of filters on a single die, and assist to cut back energy consumption.
“Soitec’s Join POI substrates have been chosen for his or her distinctive worth for RF filters,” stated Jason Chung, vice chairman of Sawnics’ foundry enterprise unit. “We’re excited to work with Soitec’s substrates, which multiply filter efficiency in comparison with filters constructed utilizing bulk piezoelectric wafers. The quantity manufacturing ramp on Join POI merchandise is predicted to begin within the second half of 2023.”
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