SEMIĀ and Semiconductor Digest at present introduced finalists for the Better of West award to be introduced atĀ SEMICON West 2023, July 11-13 on the Moscone Middle in San Francisco. The Better of West Award winner might be introduced at SEMICON West 2023 on Thursday, July 13.
Offered by SEMI Americas and Semiconductor Digest every year, the Better of West award acknowledges modern new services or products which might be considerably advancing the electronics manufacturing provide chain or a selected manufacturing functionality.
The next Better of West 2023 finalists will showcase their merchandise at their cubicles on the SEMICON West 2023 present ground.
Lam Analysis: Selective Etch Merchandise
Collaborating intently with its prospects, Lam Analysis developed an modern suite of selective etch merchandise ā Argos, Prevos and Selis. This product portfolio applies breakthrough wafer fabrication strategies and novel chemistries to assist chipmakers within the creation of their superior logic and reminiscence options for a better, extra linked world.
Sales space W4
Onto Innovation: Echo Opto-Acoustic Metrology System
The Echo opto-acoustic metrology system delivers non-destructive wafer-level metrology for measurements of single and multi-layer opaque movies ranging in thickness from 50Ć to 35Āµm. It makes use of Picosecond laser ultrasonic (PULSE) know-how, a semiconductor trade workhorse for over 20 years that gives complete metallic movie thickness metrology.
Sales space 629
SPEA S.p.A.: DOT Tester Auto UpkeepĀ Ā
That includes a mixture of good sensors, synthetic intelligence, and instrument structure, the DOT Testers Auto Upkeep characteristic permits semiconductor check gear to autonomously run full diagnostics and calibrations. The product preserves regular tester operation and requires no operator intervention.
Sales space 1161
Santec: Excessive-Accuracy Wafer Thickness Mapping System TMS-2000
The TMS-2000 maps the thickness distribution of semiconductor wafers with sub-nanometer repeatability even beneath circumstances of temperature instability or environmental vibrations, circumstances the place typical wafer thickness mapping strategies could wrestle. The system captures key wafer flatness measurements together with international flatness, website flatness and edge flatness.
