In a stride towards sustainable plane and spacecraft, Stratasys is leveraging Hexagon’s simulation software program to engineer light-weight aerospace elements. The strategic transfer seeks to expedite the introduction of modern and sustainable air and area autos. The corporate’s utilization of 3D printed plastic components holds the potential to curtail power consumption whereas enhancing the operational vary of novel plane.
Introduced in November 2022, Stratasys has harnessed Hexagon’s simulation know-how from its Manufacturing Intelligence division. This know-how delves into the dynamics of Stratasys’ ultra-lightweight Antero polyetherketoneketone (PEKK) and its additive manufacturing procedures. This partnership addresses the hesitancy surrounding adopting additive manufacturing for structural aerospace elements, primarily because of the stringent security necessities and regulatory mandates inherent to the aerospace sector.
Foster Ferguson, Stratasys’ World Director of Aerospace, underscores the importance of precision in assembly requirements and specs. The Hexagon Digimat software program emerges as a linchpin on this course of, providing the required instruments for complete knowledge characterization and technical validation.
Hexagon’s Digimat supplies alternate ecosystem integrates multi-scale fashions of Stratasys’ Antero supplies that means that engineers can now precisely predict efficiency based mostly on chosen supplies and authorised aerospace-ready 3D printers. Notably, the digital simulations embody real-world use instances and certification trials, eliminating the necessity for preliminary bodily prototypes.
Lockheed Martin’s software of Antero 840CN03 in crafting NASA’s Orion spacecraft docking hatch cowl exemplifies the practicality of Stratasys’ supplies in aerospace engineering. Foster Ferguson additionally emphasizes the economical significance of lightweighting, decreasing gas prices via weight financial savings. Past merely assembly rules, simulation software program advantages embody security assurance, equivalence testing, and avoiding overengineering pitfalls.
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