Indium Company to Function Merchandise for HIA and SiP at CHIPcon


As an trade chief in modern supplies options for heterogeneous integration and meeting (HIA) and fine-pitch system-in-package (SiP) functions, Indium Company® will function modern merchandise designed to fulfill the evolving challenges of HIA and SiP on the Chiplet and Heterogeneous Integration Packaging Convention and Exhibition (CHIPcon) hosted by IMAPS, July 24-27, in San Jose, CA.

Picture Credit score: Indium Company

Indium Company’s confirmed SiPaste® collection is particularly designed for tremendous function printing with tremendous powders starting from Sort 5 to Sort 8. They assist Keep away from the Void®, scale back slumping, and reveal constant superior printing efficiency. The newly launched, award-winning SiPaste® C201HF presents the identical superior printing efficiency with the good thing about having a washable chemistry with semi-aqueous-based options.

Because the trade chief in no-clean semiconductor flux, Indium Company will function NC-809, the primary low-residue no-clean, ball-attach flux in the marketplace. NC-809 is a dual-purpose flux, engineered with high-tack traits for flip-chip functions and with superior wetting energy for ball-attach functions. This materials is designed to carry die or solder spheres in place with out danger of die shift or solder sphere motion throughout the meeting course of.

NC-809 is designed to depart minimal residue after reflow on the degree of Indium Company’s confirmed ultra-low residue (ULR) flip-chip fluxes, reminiscent of NC-26S and NC-699. NC-809 is the primary ULR flux certified for ball grid array ball-attach functions for packages which are delicate to conventional water cleansing processes. NC-809 additionally improves manufacturing yields by eliminating pricey cleansing steps that may enhance substrate warpage, each after reflow and earlier than the underfilling steps, creating the potential for die injury and cracked solder joints.

Indium Company can even function Indium12.8HF, an award-winning, no-clean, halogen-free solder paste formulated to be appropriate with a variety of microdispensing and jetting techniques. Indium12.8HF offers distinctive deposition efficiency, and its distinctive oxidation barrier promotes full powder coalescence throughout reflow to remove graping and related reflow points.

Moreover, Indium Company will showcase QuickSinter®, a excessive steel content material paste, redefining sinter expertise. Accessible in strain and pressureless formulations, this portfolio of sintering options delivers merchandise engineered for purchasers’ particular software wants. The corporate’s suite of Thermal Interface Supplies, together with Warmth-Spring®, m2TIM, and Liquid Steel Paste can even be featured.

Supply: https://www.indium.com/

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