Intel is becoming a member of fingers with European miniaturization knowledgeable CEA-Leti to develop layer switch know-how for two-dimensional transition-metal dichalcogenides (2D TMDs) on 300-mm wafers in a quest to increase Moore’s Legislation past 2030. Intel will carry many years of R&D and manufacturing experience to this mission whereas CEA-Leti will supply bonding and transfer-layer experience together with large-scale characterization.
The 2D-layered semiconductors—like molybdenum- and tungsten-based TMDs—supply the potential to increase Moore’s Legislation by facilitating the final word scaling of MOSFET transistors. That’s as a result of 2D-FETs present innate sub-1 nm transistor channel thickness and are appropriate for high-performance and low-power platforms as a consequence of their good service transport and mobility.
Nevertheless, these traits, which make 2D-FET stacked-nanosheet gadgets a promising resolution for transistor scaling, additionally require high-quality 2D channel development. So, this multi-year mission will develop a viable layer-transfer know-how for high-quality 2D supplies grown on 300-mm most popular substrates.
“As we’re relentlessly pushing Moore’s Legislation, 2D TMD materials is a promising possibility for extending the boundaries of transistor scaling sooner or later,” mentioned Robert Chau, Intel senior fellow in know-how improvement and director of Intel Europe Analysis. In 2022, he relocated to Europe from america to guide Intel Europe Analysis.
Chau visited CEA-Leti’s Grenoble headquarters on 16 June 2023 on the launch of this multi-year analysis collaboration between the 2 entities. CEA-Leti CEO Sebastien Dauvé, additionally current at this event, mentioned that trade roadmaps present that 2D supplies shall be built-in into future microelectronic gadgets. “Switch functionality in 300 mm wafers shall be key to that integration.”
“It’s tough to stack 2D supplies as a result of they’ll hardly be deposited on a stack as common skinny layers,” he added. “So, switch holds essentially the most promise for integrating them in future gadgets.” In line with Dauvé, experience and know-how in switch improvement and characterization are CEA-Leti’s strengths.
Intel and CEA-Leti have a protracted historical past of collaboration in semiconductor design, processes, and packaging know-how.
Associated Content material
