Molex has launched a chip-to-chip interconnect portfolio working at speeds of as much as 224 Gbps PAM4 to assist next-gen knowledge facilities and generative AI. The road includes cables, backplanes, board-to-board connectors, and near-ASIC connector-to-cable merchandise.
“Molex is collaborating intently with main expertise innovators, in addition to key knowledge middle and enterprise prospects, to set an aggressive tempo for 224G product introductions,” mentioned Jairo Guerrero, VP & GM, Copper Options, at Molex. “Our clear, co-development method facilitates early engagement with stakeholders throughout the 224G ecosystem to determine and resolve potential efficiency bottlenecks and design challenges, starting from sign integrity and EMI discount to the necessity for extra environment friendly thermal administration.”
The up to date portfolio options the interconnect parts required to construct end-to-end 224G techniques requiring a number of chip-to-chip connection schemes for an optimized system design. These parts embody:
- Mirror Mez Enhanced—a 224-Gbps PAM4 mezzanine board-to-board connector with a genderless mating interface and mated peak choices;
- Inception—a genderless backplane system providing variable pitch densities, a number of wire gauge choices, simplified integration, and optimum sign integrity;
- CX2 Twin Pace—a 224-Gbps PAM4 near-ASIC connector-to-cable system with screw engagement after mating, built-in strain-relief, and a dependable mechanical wipe.
Different choices embody OSFP 1600, QSFP 800, and QSFP-DD 800 I/O merchandise, all of which characteristic SMT connector/cage, BiPass, Direct Connect, and Lively Electrical Cable options. These parts assist 224 Gbps-PAM4 per lane or mixture speeds of 1.6T per connector.
Samples of Mirror Mezz Enhanced, Inception, and CX2 Twin Pace shall be out there this summer season, with product samples of OSFP and QSFP choices slated for launch within the fall.
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